benlih huang


4381 Krause Street
Pleasanton, C.A. 94588
(925) 233-4577(home)
(925) 596-4070(cell)


Postdoctoral Research Jan. 1994 – Nov. 1995
University of California, Irvine (Advisor: Prof. E. J. Lavernia)
Nano-structured Materials Synthesis and Research using X-ray, SEM, TEM.

Ph.D. in Materials Science Sep. 1987 – Jan. 1994
Rutgers University, New Brunswick, N.J. ( Advisors: Prof. T. Tsakalakos, Dr. Michael Luton/ Exxon Research and Engineering )
Thesis Title: Synthesis of Nano-scale NiAl by Cryogenic Mechanical Alloying


March 2015 – Present, Process Engineering Manager, Sonic Manufacturing Technologies, Fremont, CA.

a. Supervised Process Engineering, Equipment Engineering, Manufacturing Engineering and Production support groups for a 300 person PCB assembly contract manufacturer on surface mount, wave soldering, mechanical assembly, X-ray inspection, automatic optical inspection (AOI), flying probe and in circuit testing for technology customers.

c. Corporate resident technical expert on all engineering & production related issues.

Nov. 2011 – March 2015, Process/materials Engineer, Microsemi(Centellax, Laser Optical Modulator), Santa Rosa, CA.

a. Oversee all contract manufacturers’ production and in-house assembly activities of hermetic gold brick 100Gb optical modulator modules and surface mount modules. Selected, evaluated and managed contract manufacturers both in the U.S and overseas, setting yield, cost & pricing goals and helping contract manufacturers achieve these goals. Worked with QA and marketing departments on RMA issue resolutions and customer facing. Resident material expert on selection, testing, processing, reliability, quality of solders, fluxes, epoxies, metallizations, surface finishes, substrates, components, ceramics, …etc. for product’s design, production, QA, and reliability.

b. Guided contract manufacturers to solve technical and business (pricing, equipment, logistics ) issues. Traveled to Asian contract manufacturers to help solve 40/100 Gb 10mm x 10 mm ceramic packaged modulator’s AuSn solder lid seal leak issue which plagued the company for 5 years, and ramped up the production to annual $3 million sales. Brought the yield from 30% to 100%. Again, I traveled to contract manufacturers to solve RF connector’s Au embrittlement issue of a major 40Gb hermetic gold brick modulator, accounted for 5 million sale annually, that severely impacted company’s revenue. Brought the yield from 55% to 100%.

c. Led R&D team developing manufacturing processes of the industry’s first production ready 19 mm x 13 mm x 2 mm SiGe & GaAs multip-chip 100-400 Gb lithium niobate over-molded and air cavity liquid crystal polymer (LCP) surface mount (SMT) optical modulators, forecasted $ 9 million annual sales,to meet the continually increasing ethernet and datacenter communication needs. These new SMT modulators can satisfy the requirements of being comparable in performance and in reliability of current gold brick hermetic modulators, yet with greater manufacturing simplicity and much reduced footprint and costs for fiber optic broadband communication. Developed multi-layered LCP substrate core & bondply stack-ups with blind and buried via structures. Transferred the over-mold SMT modulator production process to contract manufacturers and brought yield from 6% to 97.3%.

d. Successfully developed multi-chip SiGe and GaAs chip on board (COB) LCP packaging techniques with lead free solder reflow of 0201 components, followed by proper cleaning technique so as to produce a wire bondable substrate PCB. The understanding of the interactions of the chemical, thermal and wire bonding mechanisms provided insights into solving this critical issue for the production of the laminate LCP SMT modulators.

e. Fundamental investigation of humidity ingress to LCP packages with the goal of producing first in industry’s MSL level one large plastic laminate SMT modules. In addition, I established in-house SMT modules’ autoclave test, MSL test, cross sectioning, reliability and failure analysis capabilities.

Jan. 2010 – Sep. 2011, Process Development Engineer, JDS Uniphase, Milpitas, CA

a. Successfully developed and transferred to manufacturing the soldering process for 14 chip-on-submounts (COS) on a > 100 W high brightness laser module with pitch < 3 mrad, yaw < 1 degree, and roll < 3 mrad so that laser power could be combined correctly to be coupled to fiber with ~ 90% coupling efficiency. These modules would then be further combined into 4 K W fiber laser engine. b. Led the team efforts on solving the polarization extinction ratio (PER) issue of chip on submounts using design of experiment (DOE) regarding the Au-Sn solder die attach, chip location impact, bonding force, and submount surface roughness. Lower PER resulted in laser power loss through optical combiner causing reduced laser power output and reduced module reliability due to high parasitic heat. c. Successfully developed a semi-hermetic lid seal process for the > 100 W laser module and identified the proper polymeric gasket which could withstand the scattered laser light inside the module. Developed and completed the process transfer of breathing film attachment and reliability test on the lid to manufacturing.

d. Responsible for the epoxy for lens and mirror attachment and solved the processing issues regarding the low adhesion, epoxy misplacement,….etc. on COS and laser modules.

e. Solved the thermal electric cooler (TEC) and COS on platform reliability issues of 980 nm pump laser ( for broadband communications ) by solder bond line control for reliability in temperature cycling up to 2000 -40/85 oC cycles.

June 2009 – Nov. 2009, Contractor Interconnection Engineer, MiaSole’ (Thin film Solar), Santa Clara, CA

a. Discovered root causes of defects in laser soldering of diode package for solar panels, e.g., the weak soldering bond was due to unnecessary preheat in laser soldering, small wetted joints was due to improper solder paste/lead frame contact, and the most common failure in diode package was Si/Ti separation of diode, due to improper package design. Designed the next generation high volume soldering process to replace the current laser soldering process.

b. Developed six Schottky diode wafer suppliers among >65 companies, and reduced 30% diode cost for high volume 100 million (projected) chips. Established sourcing protocol for evaluating pricing, diode performance, quality criteria, packaging methods, low Vf availability, . etc.

Dec. 2007 – Mar. 2009, Staff Engineer, Formfactor, Inc., Livermore, CA

a. Provided advices on the development of next generation MEMS (Micro-electro-mechanical Systems ) probe card structure using low temperature high creep resistant solders to reduce the reflow temperature and cost, and further developed process for solder bumping and ultrafine pitch area array micro-spring structures.

b. Strengthened the creep performance of micro-springs on a MEMS wafer probe card with underfilling adhesive material and co-developed In-Pb solder/adhesive composite interconnects for a creep resistant next generation 300 mm BGA platform structure for wafer probing, which could withstand 150 oC burn-in temperature. In addition, I also developed the rework process for the manufacturing of this platform.

Jan. 1998 – Dec. 2007, Research Metallurgist, Indium Corporation of America, Clinton, N.Y.

a. Corporate Metallurgist of Indium Corporation, which supplied solder materials and fluxes for electronic assembly, semiconductor packaging and battery industries. Worked on company-wide issues of lead-free alloy strategy, patent infringements, new alloys, and solder powder production, and gave presentations on soldering technologies. Provided advices on processing, reliability, and failure analysis of interconnects for defense and commercial customers. Served as deputy manager of R&D department of 15 personnel on matters on product release, engineering and production orders, attendance, equipment management, technical management, and task assignments, .. etc., and represented the company in NEMI’s tin whisker task group.

b.Conducted workshop and presentations at semiconductor foundry and packaging manufacturers on lead free soldering developments and problem solving sessions. Worked with marketing and sales departments on new business accounts such as solar cell materials, thermal interface materials, and low k flip chip materials.

c. Theoretically and experimentally determined the interactions between lead-free solders with fluxes. Particularly on the electrochemical corrosion phenomena between the solder powder and the flux chemistries and the paste shelf life issue. Part of this work was selected and published in “Environment-friendly Electronics: Lead-free Technology” edited by Jennie S. Hwang. Based on this work, an industry leading no-clean lead-free flux was developed.

d. Developed ultra-fine type 5, 6 powder manufacturing technology for ultra-fine pitch printing and low voiding paste technology for semiconductor packaging application, particularly on the electrochemical compatibility between solder and flux systems. The breakthrough in technology of paste bumping for BGA, CSP, and wafer using stencil printing resulted in the “Best of Proceedings” paper of SMTA 2001, cited widely for solder bumping in electronic packaging. This technology has also resulted in five products.

e. Invented tin/lead and lead free anti-tombstoning alloys to support industry’s efforts in employing ultra small chips on electronic assembly, and was currently accounted for 30% of company’s paste products. U.S. patent 6,783,057 ( for tin-lead ) was granted, and U.S. PAP 2005/0100474 A1 and International publication number WO 2005/048303 A2 ( for lead free ) have been published.

f. Worked on an indium composite as thermal interface materials (TIM) for flip chip in packages to achieve high thermal conductivity, and indium-based reactive solders for bonding silicon die.

g. Developed a compliant and creep resistant Sn-Ag-Cu-(Al)Ni solder joints, particularly for the poor drop impact resistance problem by modifying the alloys with Al and Ni. Results published in ECTC 2007 and won the “Honorable Mentioned Award “of IPC in APEX 2008. The products were being pilot tested in customer’s sites.

h. Invented low temperature compliant Sn-In-Rare earth and Sn-Ag-Cu-In solder alloys for next generation flip chip interconnects for low dielectric constant ( low k) semiconductor chips. Provisional and utility patents have been filed. The flux technology has been developed, and the paste is being pilot run in semiconductor packaging manufacturers.

i. Worked on Cu-In-Ga alloys for manufacturing the sputtering targets for reactive sputtering semiconductor CuInGaSe2 solar cell application with efficiency exceeding 19%.

j. Worked on developing lead free high temperature solder alloys to replace the high lead solders for semiconductor applications.

Nov. 1995 – July. 1997 Materials Engineer, Smith MegaDiamond Inc. Provo, U.T.

a. Invented multi-layered polycrystalline diamond (PCD) and cubic boron nitride cutters.

b. Studied the fracture toughness of PCD with respect to the impact of particle size, WC-Co content and pressure and time on the liquid phase sintering of the PCD.

c. Developed sub-micron PCD products with 30% increase in fracture toughness.


U. S. Citizen. Naturalized in Rome, New York.


American Society of Quality (ASQ) Six-Sigma Green Belt: 64186629. April 2011.


Benlih Huang and Ning-Cheng Lee, “ Anti-tombstoning solder alloys for surface mount technology”, U.S. Patent 6,783,057 B2.
Benlih Huang and Ning-Cheng Lee, “ Lead-free anti-tombstoning alloys for reflow soldering”, U.S. PAP 2005/0100474 A1.
G. Rai , Benlih Huang , Ronald Eyre, Nathan Anderson, “ Non-planar interfaces for cutting elements” filed and assigned USSN 60/033,239.
Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Technique to increase the compliance of tin-indium solders“ Provisional patent filing USSN 60/712,175. Utility patent filing U.S. 11/360,812..
Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Compliant low temperature Tin-Silver-Copper-Indium solders“ Provisional patent filing U.S. 60/720,039, Utility patent filing U.S. 11/422,782.
Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Technique for increasing the compliance of lead free solders containing silver “, Provisional patent filing U.S. 60/729,245.


1. SMTA (Surface Mount Technology Association) “Best of Proceedings” award 2001
“Low Cost Solder Bumping via Paste Reflow” by Benlih Huang and Ning-Cheng Lee.
2. “ Highly Commended Award “ 2006, among the articles published by Soldering & Surface Mount Technology in 2005, by Emerald Publishing, “ Effect of SnAgCu composition on soldering performance “ Benlih Huang, A. Dasgupta and Ning-Cheng Lee, Soldering & Surface Mount Technology Vol. 37, No. 3, p. 9. 2005.
3. IPC in APEX 2008 “ Honorable Mentioned Paper “ award 2008, “ A compliant and Creep Resistant SAC-Al(Ni) Solder “ by Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee.


Benlih Huang and Ning-Cheng Lee, “ Lead-free Solders and Flux in Reflow Soldering” Chapter 21, “Environment-Friendly Electronics: Lead-free Technology” edited by Jennie S. Hwang, Electrochemical Publication, P. 484, 2001.
Benlih Huang and E. J. Lavernia, “ Materials synthesis by mechanical alloying” Journal of Materials Synthesis and Processing, Vol. 3, No. 1, P. 1, 1995.


1. Taiwan UMC Packaging Group, speaker, “A compliant and creep resistant SAC-Al(Ni) Solder”, HsinChu, Taiwan, July 29, 2007.
2. SMTA-Chicago Chapter, speaker, “ Controlling lead free tombstoning “Lead free soldering conference, Chicago, IL, June 8, 2005.
3. IMAPS-Chicago-Milwaukee Chapter, speaker, “Conquering lead free tombstoning via composition” Lead free soldering symposium, Chicago, IL, April 20, 2005.
4. IMAPS-Optoelectronics Packaging workshop, speaker, “Compatibility of Lead-free Solders with Reflow Process” Bethleham, PA, Oct. 11, 2001.
5. IMAPS-Keystone Chapter, “ Prospect of Lead free Solders for Reflow Soldering “ speaker, Philadelphia, PA, March 23, 2000.


Reviewer, IEEE Transactions of electronics packaging and manufacturing.
ASE International, member.
TMS, The mineral, metals and materials society, member.


Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “ Compliant and creep resistant SAC-(Al)Ni Solder “, Proceedings of ECTC 2007, Reno, NV, p. 184.
Benlih Huang and Ning-Cheng Lee, “Lead-free: controlling tombstoning behavior “, SMT ( Surface Mount Technology) , July, p. 44, 2005.
Benlih Huang, A. Dasgupta and Ning-Cheng Lee, “ Effect of SnAgCu composition on soldering performance “ Soldering & Surface Mount Technology Vol. 37, No. 3, p. 9. 2005.
Benlih Huang and Ning-Cheng Lee, “ Low cost solder bumping via paste reflow”, Journal of Surface Mount Technology, Jan/Mar. vol. 15, issue 1, p. 16, 2002.
Benlih Huang and Ning-Cheng Lee, “ Low cost solder bumping for area array bumping”, Global SMT & Packaging Vol. 1, No. 2, . p. 28. Aug. 2001.
Benlih Huang and Ning-Cheng Lee, “ Compatibility of lead-free solders with reflow process “ Proceedings of IMAP Meeting, Nov. 1999.
B. Huang, H. G. Jiang, R. Perez, S. N. Nutt, and E. J. Lavernia, “ The effect of Ni on the cryogenic attritor milling of Metglass Fe78B13Si9”, Nanostructured Materials, Vol. 11, p. 1009, 1999.
Benlih Huang, R. J. Perez, H. Hu, and E. J. Lavernia, “ Grain growth of nanocrystalline Fe-Al alloys by cryomilling in liquid argon and liquid nitrogen” Materials Science and Engineering A, Vol. 255, p. 124, 1998.
B. L. Huang, C. Weis, Xian Yao, D. Belnap, and G. Rai, “Fracture toughness of sintered polycrystalline diamond” Proceedings of 5th International Conference on Advanced Particle Materials and Processes, April, 1997.
Benlih Huang, R. J. Perez, E. J. Lavernia, and M. J. Luton, “ Formation of supersaturated solid Solution by mechanical alloying” Nanostructured Materials, Vol. 7, Nos1/2, p. 67, 1996.
Benlih Huang, R. J. Perez, P. J. Crawford, A. A. Sharif, and E. J. Lavernia, “ Mechanical crystallization of metglas Fe78B13Si9 during cryogenic mechanical milling” Nanostructrued Materials, Vol. 7, Nos ½, p. 57, 1996.
Benlih Huang, J. Vallone, and M. J. Luton, “ The effect of nitrogen and oxygen on the synthesis of NiAl during cryomilling” Nanostructured Materials, vol. 5, No. 6, p. 631, 1995.
Benlih Huang, R. J. Perez, P. J. Crawford, A. A. Sharif, S. R. Nutt, and E. J. Lavernia, “ Mechanically induced crystallization of Metglas Fe78B13Si9 by cryogenic high energy ball milling” Nanostructured Materials, Vol. 5, p. 545, 1995.
Benlih Huang, J. Vallone, and M. J. Luton, “ Synthesis of nanocrystalline B2 NiAl through cryogenic mechanical alloying “, Nanostructured Materials, Vol. 5, No. 4, p. 411, 1995.
R. J. Perez, Benlih Huang, E. J. Lavernia, “ Thermal stability of nanocrystalline Fe-10wt.%Al produced by cryogenic mechanical alloying” Nanostructured Materials, Vol. 7, No. 5, p. 565, 1996.
Benlih Huang, J. Vallone, C. F. Klein, and M. J. Luton, “ Synthesis of B2 NiAl by cryomilling”, MRS Proceedings of Particulate Materials, Edited by R. Rhodes, p. 21, 1992.
I. Baker, Benlih Huang, and E. M. Schulson, “ The effect of boron on the lattice properties of Ni3Al” Acta Metallurgica, Vol. 35, p. 73, 1988.


a. Christian Bourde’, Senior Director of Engineering, Microsemi
b. Hiroshi Kondoh, Chief Operating Officer, Centellax (formerly)
c. Mike Bryant, QA Manager, LithiumStart LLC

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