Mark Allemang

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Mark Allemang Last updated: 05/13/15
Job Title: no specified

Company: no specified

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374 Summerfield Ct
Ambler, PA 19002
US

Mobile: 215-760-5887
mdallemang@me.com
Contact Preference: Telephone

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RESUME

Resume Headline: Allemang2015M Resume Value: qetekmd62r9ncjns

Mark D. Allemang
(215) 760-5887 ? mdallemang@me.com
374 Summerfield Ct, Ambler, PA 19002
OBJECTIVE:
To obtain a technical leadership position using my experience in quality, project/program management, electrical engineering, component engineering and advanced manufacturing technologies

QUALIFICATIONS SUMMARY:
• Quality Assurance and Reliability experience (22+yrs) in manufacturing and product/process development
• Technical Program Management / Development experience (10+ yrs) for Commercial and Defense projects
• High Level Project Management experience: budget, staff, training and cross-functional teams
• Experience writing complex proposals and requirements analysis for business development and compliance
• Experience in Electronic Components, Materials / Processes, Packaging, Test, and Supply Chain
• Developed customer / contractor relationships with U.S. Military (Air Force, U.S. Navy, U.S. Army)
• Technical experience in electronics manufacturing and packaging, systems, analytical test, device physics

PROFESSIONAL EXPERIENCE:

Lockheed Martin Corporation, Moorestown, NJ (Mission Systems and Training [MST]) Mar 2015 – Present
Senior Member of Engineering Staff – Reliability, Maintainability and Availability
Active Secret Clearance
• Lead Engineer, Aegis Radar TI-16 upgrade, FMECA, Reliability / Availability Analysis
• IRAD work for HALT Testing on Long Range Discrimination Radar Program
• Failure and Material Analysis subject matter expert

Lockheed Martin Corporation, Newtown, PA (Space Systems Company [SSC]) Nov 2012 – Feb 2015
Materials Engineering Asc Mgr – Specialty Engineering, Electronic Subassemblies Group
Active Secret Clearance
? Led and provided Technical Guidance for the following Program and SSC Technical Teams:
◦ Led Engineering Corrective Action Board Enterprise Level Response for “Technical Risk for usage of Copper Bond Wires in Microcircuits”, Coordinated cross-discipline Corrective Action Plan utilizing Procurement, Materials Labs, Quality and Mission Success talent across SSC and Enterprise
◦ Led GPSIII Program affordability effort involving Honeywell Reaction Wheel Assemblies to requalify existing Hybrid assembly stock to meet Aerospace TOR RMA requirements saving $500k
◦ Engaged in Functional Complex Parts and Hybrids initiative for Common Design, focused on reliability and quality standard requirements by collaborating with vendors and customers
◦ Specialty Functional Technical Representative for an Enterprise Failure Review Board for Reaction Wheel failure to approve risk reduction plan and corrective action on AEHF, MUOS, GPSIII programs

? Lead 20 direct reports as a Functional Leader in Electronic Subassemblies area of Specialty Engineering
◦ Assisted A2100 IRAD and FBM programs find technical experts for collaboration strategies
◦ Completed Leadership and Green Belt training

Lockheed Martin Corporation, Newtown, PA (Space Systems Company) Oct 2008 – Nov 2012
Hardware Electronics Engineer Staff – Specialty Engineering, PMP Group
? Technical Liaison for the GPS-III Program as Lead PMP Engineer responsible for managing Subcontractors General Dynamics and Honeywell, Attained full Award Fee for CDR, MRR, TRR milestones
? Reviewed and approved Trade Study for Communications box addressing and overall lifetime program cost
? Commodity Subject Matter Expert for Hybrids, Magnetics, Transistors and Microcircuits for the GPS III, Lead technical resolution of MRB, Vendor Request (VRIC), and PMP Control Board approvals
? Completed over 20 AS9100 based Quality audits to approve suppliers and electronics / radiation testing laboratories for the GPS III project – Corrective actions resolved with favorable results
? Certified Material Review Board Member GPS III – active in reviews and disposition approvals, Member of Corrective Action Board and Failure Review Board for GPS III, results addressed in GPS III ROMB

American Competitiveness Institute, Philadelphia, PA (Electronics Manufacturing Technology)
Advanced Manufacturing Technologies Manager Oct 2007 – Aug 2008
? Management of 4 Lead Engineers and a highly technical total staff of 20 responsible for executing R&D projects in electronics manufacturing for insertion into Navy and Army programs

Mark D. Allemang

? Responsible for project management, development and budget for $22M of R&D electronics manufacturing technology projects with the following examples and accomplishments:
• Monolithic Microwave Integrated Circuit (MMIC) Flip Chip RF technology for the F/A-18 Fighter Jet
• Digital Receiver / Exciter for X-band Radar for the DDG1000 Destroyer
• Silicon Germanium System on Chip for Low Cost Phased Array Communications
• Power Electronic Modules for IFTP on the Integrated Power System (IPS) for Navy DDG1000 Destroyer
• Micro-Electro-Mechanical Systems (MEMS) sensors for High-g Packaging on DDG-1000 Destroyer
• Led win of multi-million dollar Navy proposal for “Benchmarking and Best Practices Center of Excellence”
• Utilized Key Process Indicators to improve performance including Technology Roadmaps, Earned Value, Technology Readiness Levels, critical path and milestones
• Organized focused, periodic reviews of all projects for technical approach, schedule, budget, deliverables, risk assessment (safety/scope), implementation and subcontractor contract status
• Developed subcontractor relationships with large defense and commercial companies (e.g. Raytheon, Northrop Grumman, Boeing, Honeywell, L3), universities (PSU-ARL, JHU-APL) and suppliers
• Teamed with finance, human resources and contracts to organize cross-functional support for new projects, monthly/quarterly financial goals, contract reviews and personnel requirements

? Responsible for technical and project management execution in 3 Electronics Technology Areas for business development; Electronics Manufacturing Factory, Training Center, Analytical Services
• Coached Lead Engineer in scheduling and supply chain management for customer assemblies in Rapid Prototyping and Engineering Support resulting in improved cycle time and repeat business
• Assisted Lead Engineer in building a team of trainers for electronics manufacturing IPC skills and certifications, Failure Analysis and Advanced Packaging classes to maximize a matrix of resources
• Improved the ISO9000 Quality System process documentation including SPC, Safety, ESD, internal audits, corrective action request (CAR), FMECA and customer satisfaction

Lead Applied R&D Engineer (project management) 12/05-10/07
• Lead project management, technical tasks and performance reviews for 4 manufacturing technology projects ($9M) for the Army and Navy that met or exceeded schedule, budget and goal metrics
• Reviewed and approved with MIL-HDBK-217B Reliability analyses from subcontractors
• Completed ISO 9001:2000 auditor training

Senior Applied R&D Engineer 1/02-12/05
• Completed project management planning / execution for 4 on-time projects ($8M), that resulted in successful implementation of advanced and cost-saving technology into military aircraft
• Developed and expanded equipment / process capabilities for RF/DC reliability and failure analysis

Allegro Microsystems Inc., QA Dept., Willow Grove, PA (Integrated Circuit Wafer Fabrication)
Quality Engineer III 6/90-12/01
• Supervisor of Electronics Failure Analysis Lab including 2 technicians, 2 operators
• Coordinated and approved work in 3 areas of test, failure analysis, reliability and quality assurance:
1.Wafer level integrated circuit fabrication processing failure analysis
2.Packaged device integrated circuit reliability testing and customer return failure analysis
3.Final Outgoing Inspection audit of wafers for PPM level and engineering disposition
4.Corrective action resolution with R&D, Manufacturing, and Product Engineering

Texas Instruments Inc., Failure Analysis Lab, Dallas, TX (Integrated Circuit Wafer Fabrication)
Failure Analysis Engineer 6/86-8/88
• Responsible for performing Failure Analysis on analog and digital integrated circuits
• Supervised a technician working in Failure Analysis

EDUCATION:
M.S. in Electrical Engineering 9/88-6/90
Drexel University, Philadelphia, PA
GPA: 3.75/4.00
Concentration: Semiconductor Device Physics, Minor: Systems, Digital Signal Processing
Thesis: “Fabrication and Experimental Aspects of High Power Gate-Turn-Off Thyristors”
Mark D. Allemang

Research Assistant sponsored by General Electric Co., Static Power Div., Malvern, PA
B.S. in Engineering Science May 1986
The Pennsylvania State University, University Park, PA
GPA: 3.42/4.00,
Honors Thesis: “A Study of Hydrogen Isotope Effects in Radiation Damaged MOS Devices”

COMPUTER SOFTWARE EXPERIENCE:
PSPICE circuit simulation, IC design layout and simulation courses
National Instruments: LabVIEW
Microsoft: Windows, Project 2010, Powerpoint, Excel, Office, Visio
Defense Acquisition University: ACQ101 training
Reliasoft: Weibull 6
Adobe: Acrobat, Photoshop
Filemaker: Filemaker Pro Database
PUBLICATIONS:
M. Allemang, J. Butler, Reliability Results of Flip Chip Bumped GaAs MMIC Daisy-Chain Test Vehicles, Defense Manufacturers Conference, Nov. 2005

T. Taylor, M. Allemang, S. Nichols and L. Wagner, “Failure Analysis of Inversion Mechanisms Beyond Bake Recoverable”, International Symposium or Testing and Failure Analysis (ISTFA), 1988, pp 217.

HONORS:
Eagle Scout, Boy Scouts Of America, Assistant Scoutmaster
Engineer in Training (E.I.T.) certification
University Scholars Program (Honors Major) in Engineering Science
Tau Beta PI National Engineering Society
ACTIVITIES:
Member: Institute of Electrical and Electronic Engineers
Music (Project Studio)
Astronomy

Additional Info BACK TO TOP

Current Career Level: Manager (Manager/Supervisor of Staff)

Years of relevant work experience: More than 15 Years

Work Status: US – I am authorized to work in this country for any employer.

Active Security Clearance: None

US Military Service:

Target Company: Company Size:

Target Locations: Selected Locations: US-PA-Philadelphia

Willingness to travel: Up to 50% travel

Languages: Languages Proficiency Level
German Beginner