Roman Lyubarsky

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Roman Lyubarsky
Last updated: 05/15/14

Job Title: no specified
Company: no specified
Rating: no specified
Screening score: no specified
Status: no specified

Brooklyn, NY 11229
US

Mobile: 917-733-0041
rlyubarsky@yahoo.com
Contact Preference: Email

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RESUME

Resume Headline: Roman Lyubarsky – Mechanical Engineer Resume Value: ar3hmwr7b5z7ffaa

Roman Lyubarsky
1835 East 14th St. Apt. 4A Brooklyn, NY 11229
917-733-0041
rlyubarsky@yahoo.com

OBJECTIVE

Mechanical design/analysis position utilizing and expanding upon knowledge of and experience in using engineering skills.

MECHANICAL ENGINEERING EXPERIENCE

TELEPHONICS, CORP. Farmingdale, NY
Mechanical/Thermal Engineer 8/2009 – present

• Lead engineer on several military electronics packaging projects that require all aspects of mechanical engineering from concept to delivery of hardware. Tasks include budget estimates, schedule input, requirements analysis, design and analysis of product, qualification environmental testing, and handling of production issues.

• Extensively perform system and detail thermal analyses (CFD) using Solidworks and I-Deas Flow Simulation for electronics cooling and thermal management to optimize thermal performance of various military communications and radar products per customer and military standards with consideration to the effect of conduction, natural and forced convection (fan selection), radiation, thermal solution real estate, heat source thermal wattages, mechanical attachments, performance, weight reduction, reliability, schedule, and cost.

• Extensively perform system and detail structural analyses using Solidworks and I-Deas/Nastran to determine modal frequencies, dynamic loads, deflections and fatigue loads for random and sine vibration, shock and other structural environments for various military communications and radar products per customer and military standards to optimize performance, reduce weight and cost.

• Lead mechanical engineer on several qualification testing projects. Created detailed procedures, schedules, interfaced with customers and vendors, created qualification reports on the qualification of multiple communication products. All qualification projects were completed within budget and schedule.

• Lead mechanical engineer on engineering evaluation testing. Created detailed procedures and schedule. Interfaced with multiple engineering groups to perform thermal testing on communication products. Created engineering reports and recommendations for product improvements.

• Created 3D models and 2D detail drawings of parts and assemblies for documentation control.

• Performed tolerance analyses for form, fit & function and reviewed 2D part, assembly drawings and parts lists prior to release of documentation.

FREQUENCY ELECTRONICS, INC. Uniondale, NY
Mechanical/Thermal Engineer 8/2007 – 4/2009

• Performed system and detail Finite Element Analyses using Ansys to determine modal frequencies, static loads and deflections for random and sine vibration environments for various space flight electronic packaging products per customer and military standards.

• Performed system and detail thermal analyses using Ansys to determine thermal resistances and temperature distributions of PCB’s and maximum operation temperatures of electronic components within thermal environments for various space flight electronic packaging products per customer and military standards.

• Created 3D models and 2D detail drawings of parts and assemblies using Inventor for documentation control.

• Performed tolerance analyses for form, fit & function and reviewed 2D part, assembly drawings and parts lists prior to release of documentation.

• Created top level visual aids for manufacturing assemblies to reduce errors as well as assembly time.

COMTECH PST, INC.Melville, NY
Mechanical/Thermal Engineer 8/2006 – 8/2007

• Sole mechanical engineer within the company.

• Involved in every aspect of mechanical engineering from design to delivery of the product to the customer.

• Using Icepak and finite element and CFD methods, performed conduction and convection (air and liquid cooled) system thermal analyses to determine temperature distributions of PCB’s and maximum operation temperatures of electronic components within various thermal environments for electronic packaging products per customer and military standards.

• Performed various vibration, weight, and stress analyses in order to meet customer specifications and requirements.

• Reviewed all mechanical and environmental requirements for potential projects.

• Created 3D models and 2D detail drawings of parts and assemblies using Inventor for documentation control.

• Performed tolerance analyses for form, fit & function on all mechanical parts and assemblies.

• Performed various environmental tests including vibration and temperature cycling.

• Prepared presentations and presented the performed work during the Preliminary and Critical Design Reviews for the customer.

SYMBOL TECHNOLOGIES, INC.Holtsville, NY
Mechanical Engineer 1/2006 – 8/2006

• Involved as the Lead Mechanical Engineer on several projects during the RoHS compliance of products.

• Created 3D models and 2D detail drawings of parts and assemblies using I-Deas for documentation control.

• Performed various mechanical tests on hand held scanners including random and sine vibration, shock, drop, thermal cycling and prepared reports to detail the test results.

SAIC/ SIKORSKY AIRCRAFT
ADVANCED CONCEPTS DIVISION Bridgeport, CT
Mechanical Engineer 7/2005 – 1/2006

• Design and modification of 3D modeling and 2D drawings.
• Performed Line of Sight and Field of View analyses on the aircraft structure.

ITT INDUSTRIES
SPACE SYSTEMS DIVISION Rochester, NY
Structural Design Engineer 6/2003 – 7/2005

• Design and analysis of critical components for a large optics composite aerospace support structure.

• Extensive use of proprietary tools and finite element methods to perform detailed ply-by-ply stress analyses for composite, buckling analyses and detailed stress analyses of metallic parts, bonded joints and fasteners.

• Macro and micro mechanical analyses of laminated composite materials.

• Prepared presentations and presented the performed work during the Preliminary and Critical Design Reviews for the customer.

• Designed, modeled and analyzed several development testing parts in 3D and prepared 2D drawings using UniGraphics to be used for prime and assembly testing.

• Designed, modeled in 3D, produced 2D drawings, analyzed and coordinated a static load test of prime and support hardware.

• Designed, modeled and analyzed the prime struts and fittings for the Outer Barrel Assembly.

MECHANICAL ENGINEERING STUDIES

University of RochesterRochester, NY
Bachelor of Science in Mechanical Engineering with Honors May, 2003
Minor in Optics

• Overall GPA: 3.42 (out of 4.0)/ Major GPA: 3.43 (out of 4.0)

• Dean’s List: Spring 2000, Fall 2001, Spring 2002, Spring 2003

• Intramural Basketball and Football

• HEOP Achievement Award

COMPUTER SKILLS AND OTHER QUALIFICATIONS

• Capacities to use, teach others, and support Solidworks, Solidworks Simulation, and Flow Simulation,
I-Deas, NASTRAN, PATRAN, Icepak, UniGraphics, , DOORS, Autodesk Inventor, , Word, Excel, PowerPoint, Windows and Internet applications.

• Knowledge of Geometric Dimensioning and Tolerancing (G D & T) ASME Y14.5M-1994

• Bilingual Russian-English skills.

• US Citizen with a TS/SSBI security clearance.

• Ability to work well individually and as part of a team as well as integrally with other interdisciplinary program teams on large-scale projects.

Experience BACK TO TOP
Job Title Company Experience
Mechanical Engineer Telephonics Corporation – Present

Additional Info BACK TO TOP

Current Career Level: Experienced (Non-Manager)

Years of relevant work experience: 7+ to 10 Years

Date of Availability: Within one month

Work Status: US – I am authorized to work in this country for any employer.

Active Security Clearance: Inactive Clearance

US Military Service:

Citizenship: None

Target Job: Target Job Title: Mechanical Engineer

Target Company: Company Size:

Occupation: Engineering • Aeronautic/Avionic Engineering
• Bio-Engineering

Target Locations: Selected Locations: US-TX-Dallas

Relocate: Yes

Willingness to travel: Up to 100%

Languages: Languages Proficiency Level
Russian Fluent