Timothy Schaefer

Timothy M. Schaefer
5375 15th Street SE
Rochester, MN 55904
schaefer.timothy@gmail.com
(507) 269-2830

Skills Summary
• 15+ years’ experience in RF Communication Systems (simulation, waveform development, system design, antenna development, and implementation) for terrestrial, airborne, commercial satellite, and NTM
• Designed, Developed and Delivered new tagging, tracking and location (TTL), custom receivers and communications systems (traditional and non-traditional) for the DOD/USGC
• Conducted research in Signal, Image, and Video processing techniques for extreme low noise operation (Low SNR Processing Techniques for non-coherent signals, non-coherent signal detection, Algorithm development and waveform design)
• Conducted research on Navigation Processing Techniques (enhanced performance of hyperbolic navigation algorithms, TDOA, PDOA, and FDOA processing techniques).
• Test and Measurement Experience (test plan development, documentation, and actual testing)
• Conducted CONOP Development for DOD/USGC for TTL and Communications Systems
• 15+ years’ of conducting New Business Development, and Technical Proposal writing (White Papers, Full Proposals (small business and large business ), SBIR Responses)
• Conducted successful client interactions and development and program management from seedling funding and to full programs
• Conducted OCONUS delivery for DOD/USGC, training and support of multiple systems
• Experienced with Matlab, Altium, Embedded Software, and Microsoft Office
• USGC Certified Trainer
• ISO-9001 Trained

Work Experience
Senior Lead Technologist / Lead Associate
Booz Allen Hamilton
1/13 – 11/15
Internal Responsibilities
• Develop Signal Processing/Detection Algorithms
• Waveform Development
• SIGINT Receiver Hardware/Software Development
• Cubesat / Nano-Satellite Ground Station Design, Development and Maintenance
• New Generation OTH RF Tag Development (Concept to Deployment)
• RADAR Responsive Tag Development
• Proposal Writing
External Responsibilities
• New Program Development

Senior Scientist/Technical Director
SDI Corporation (Acquired by Booz Allen Hamilton)
8/08 – 1/13
Internal Responsibilities
• Conduct research into different advanced tagging techniques
o Develop hardware to support system utilization and deployment
o Develop advanced signal detection algorithms
• Conduct research into how to exploit signal coupling
o Advanced Signal, Image and Video Processing Research
• Micro-Tagging system demonstration and deployment
• New Generation RF Tag development and demonstration
• Unconventional Communication System Development
o UWB Communications
o LPI/LPD Waveform Development
External Responsibilities
• New Program Development
• Government Technical Advisor

Technical Director/Program Manager
IISI Corporation
8/06 – 8/08
Internal Responsibilities
• Technical Lead – Design, Layout and Characterization of Transmitter Systems in the L-Band and C-Band
• Technical Lead – Design, Layout and Characterization of Beaconing Systems covering UHF, GSM, and L-Band
• Develop the Transmitter Architecture and Implementation of the System
o Conducted End to End System Development
• Signal Analysis of the Transmitters
o Soft Receiver
o Signal Decoding
• Support Field Testing with the Government
• Conducted analysis of GSM signals to determine efficient ways of detecting and extracting tracking information
External Responsibilities
• New Program Development
• Government Technical Advisor
o Audio-on-the-Move / Geo-Location Program
o Advanced Tagging and Tracking Research and Exploitation

Senior Project Engineer II/ Program Manager
Mayo Foundation – Special Purpose Processor Development Group
Employed 6/98 – 8/06
Internal Responsibilities
Program Manager
• Maintain responsibility for program financial and resources of $3M-$5M per year
• Manage several teams of individuals to support the customer’s mission
• Responsible for team coordination and program vision execution
Technical Responsibilities
• New Program Development
o Example Programs (RF Tagging, Short Pulse Receiver, Covert Communications)
• RF Tagging
o Architectural Design and Development
o RF Link Analysis
o System Design and Evaluation
o Antenna Design and Evaluation
o Field Support and Platform Integration in support of the customer
• Receiver/Covert Communications
o Architectural Design and Development
o Hardware Design and Integration
o Signal Processing Advisor
External Responsibilities
Government Technical Advisor
• Provide Technical Feedback and evaluation on government contracts (DARPA, Navy, and Intelligence Community)
• “Trusted” Technical Resource for Government Program Managers
Program Manager
• Secure funding to support existing ($2M-$4M) and new technology efforts ($1M-$2M)
o New Concept Generation
o Proposal Writing
• Reporting and Briefing to customers
Technology Transfer
• Relationship development between government entities to facilitate technology transfer and utilization (Technology Transfer from DARPA to the intelligence community)

Project Engineer
Mayo Foundation – Special Purpose Processor Development Group
Employed 6/93 – 6/98
• Designed and simulated MEMS resonators and switch arrays for low noise acoustic transduction
• Designed a cost effective miniaturization of a Video Controller Subsystem allowing for the inclusion of advanced packaging techniques into Apple’s next generation laptop computer.
• Multi-Chip Module intended to embed multi-chip module technology into electronic equipment targeted for the consumer electronics environment.
• Designed 26 Chip Demonstration Multi-Chip Module demonstrating digital single circuit operation at 24 GB/sec and multi-chip operation up to 12 GHz
• Designed 16 Chip Demonstration Multi-Chip Module utilizing Texas Instruments’ Chips First HDI Technology.
• Designed Analog portion of a Micro-Miniature GPS Receiver to allow for micro-miniaturization insertion
• Designed and electrically characterized several test fixtures utilizing a unique non-destructive compression mechanism.
• Directed testing of 12 GB/s (12 GHz Clock Rates) GaAs Digital Circuits.
• Directed testing of various GaAs circuit technologies, including HBT, HEMT.
• Worked with different types of logic, CML, ECL, CMOS, directing testing, analysis of results, and troubleshooting to achieve maximum performance
• Mentor Computer Aided Design Manager.

Simulation Specialist
Mayo Foundation – Special Purpose Processor Development Group
Employed 12/91 – 6/93
• Conducted Simulations on High Speed Silicon and GaAs Digital Systems.
• Conducted chip and system level simulations including extraction of interconnect parasitic effects.
• Aided in the evaluation of New Semiconductor Technologies.
• Conducted Active Device Modeling on to extract SPICE parameters.
• Developed design techniques to reduce ElectroMagnetic effects.
• Aided in the development and design of active devices utilizing Quantum Well Devices.
• Collaborated on various DARPA and DOD sponsored Projects for the advancement of New Semiconductor Technologies

Consultant
MBO Partners
11/15 – 12/15
• Conducted Satellite Ground Station Test and Evaluation

Consultant
Mitre
6/06 – 6/10
• JICRD Reviewer
• Review of Government Programs
• ASIC Advisor
• Covert Communications Advisor
• Advanced TTL Concepts Advisor

Consultant
Rite Solutions
6/05-6/06
• Generation of action plans for implementation of corporate technology
• Review of proposal topics – generation/review of concept papers
• Review of proposals
• Review of Government presentations

Consultant
Triton Systems
6/03-8/05
• Generation of action plans for implementation of corporate technology
• Review of proposal topics – generation/review of concept papers
• Review of proposals
• Review of Government presentations

Published Papers/Patents

Paper – Asynchronous Spread Spectrum Communication for a Micro-Miniature Transponder: Implementation and Test Results. Holmes, D. R., III, E. B. Welch, R. A. Philpott, J. D. Coker, T. M. Schaefer, B. K. Gilbert, and E. S. Daniel:. Proceedings of SPIE, The International Society for Optical Engineering, Volume 5819, Digital Wireless Communications VII and Space Communication Technologies, edited by, Rao, R. M., et al., pp. 231-236, March 28-31, 2005, Orlando, FL.
Paper – Asynchronous Spread Spectrum Communication Paradigm for Use In Low-Power Applications: Description and Simulation Results. Welch, E. B., D. R. Holmes, III, J. D. Coker, T. M. Schaefer, B. K. Gilbert, and E. S. Daniel: Proceedings of SPIE, The International Society for Optical Engineering, Volume 5819, Digital Wireless Communications VII and Space Communication Technologies, edited by, Rao, R. M., et al., pp. 222-230, March 28-31, 2005, Orlando, FL.

Paper – Laser Direct-Write and Its Application in Low Temperature Co-Fired Ceramic (LTCC) Technology. Zhang, C., D. Liu, S. A. Mathews, J. Graves, T. M. Schaefer, B. K. Gilbert, R. Modi, H.-D. Wu, and D. B. Chrisey: Microelectronic Engineering, 70(1):41-49 (October) 2003

Paper – Electronic Packaging for 10-100 Gb/s OE Systems. Fokken, G., E. Daniel, M. Degerstrom, T. Schaefer, P. Zabinski, and B. Gilbert:. The 14th Annual Meeting of the IEEE Lasers and Electro-optics Society, 2001, LEOS 2001, Volume 2, pp. 861-862, November 11-13, 2001, San Diego, CA.

Paper – The Use of Laminate Multichip Modules for the Packaging of 9-GHz Digital Multichip Circuits. Schwab, D. J., B. Randall, P. J. Zabinski, T. M. Schaefer, and B. K. Gilbert: IEEE Transaction on Advanced Packaging, 25(1):79-91 (February) 2002.

Paper – Emerging Multi-gigahertz Digital And Mixed-Signal Integrated Circuits Targeted For Military Applications: Dependence On Advanced Electronic Packaging To Achieve Full Performance. Gilbert, B.K., M.J. Degerstrom, P.J. Zabinski, T.M. Schaefer, G.J. Fokken, B.A. Randall, D.J. Schwab, E.S. Daniel and S.C. Sommerfeldt Proceedings of the IEEE; 89 (4) pp. 426-443 – April 2001.

Paper – A Novel MCM Structure for High Performance Digital and Mixed Signal Applications. Cotton, C.D., Kling, D.R., Yeomans, M., Schaefer, T.M. and Gilbert, B.K Proceedings: International Conference and Exhibition on High Density Packaging and MCMS MCM’99 Conference, Denver CO., April 7-9, 1999, pp. 114-119. ISBN: 0-930815-57-2

Paper – Design and Test Methodology for an Analog-to-Digital Converter Multichip Module for Experimental All-Digital Radar Receiver Operating at 2 Gigasamples/Second. Thompson, Rick, L., Eric L. H. Amundsen, Timothy M. Schaefer, Paul J. Riemer, Michael J. Degerstrom, and Barry K. Gilbert: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging; 22 (4) 649-664 – November 1999

Paper – Integrated Passive Components for RF Applications. Benson, Donald C., Yongnan Xuan, Jiamin He, Chang-Ming Lin, Charles R. Hodges, and Elizabeth A. Logan, Timothy M. Schaefer and Barry K. Gilbert. 1997 Wireless Communications Conference, Boulder, CO., August 11-13, 1997 pp. 175-180.

Paper – A Chips-First Multi-Chip Module implementation of both Passive and Active coupons utilizing Texas Instruments High Density Interconnect Technology. Timothy M. Schaefer, Barbara A. Randall, Gregg J. Fokken, Daniel J. Schwab, Barry K. Gilbert, and Jeffery J. Kacines. IEEE Transactions on Components, Packaging and Manufacturing Technology. May 1996, pp. 404-416.

Paper – Performance of TI High Density Interconnect for 1 GHz Digital MCM Applications. Kacines, Jeffery J., Timothy M. Schaefer, and Barry K. Gilbert.
Proceedings of the 45th IEEE Electronic Components & Technology Conference,
May 1995, pp. 669-673.

Paper – Comparison of Multi-chip Module Technologies for the Electronic Packaging of High Performance Digital and Mixed Mode Systems. Barry K. Gilbert, Daniel J. Schwab, Barbara A. Randall, Rick L. Thompson, Rick J. Hakes, Lloyd O. Mielke, Timothy M. Schaefer, Patrick J. Zabinski, and Wayne L. Walters. Proceedings of Government Microcircuit Applications Conference (GOMAC), November 1993, pp. 423-430.

Patent – “Asynchronous Communication System for Remote Monitoring of Objects or an Environment”. Granted by U.S. Patent Office, November 09, 2010, Patent #7,830,948 to Timothy M. Schaefer.

Patent – “Asynchronous Communication System for Remote Monitoring of Objects or an Environment”. Granted by U.S. Patent Office, January 5, 2010, Patent #7,643,536 to Timothy M. Schaefer.

Patent – “Lateral Motion MEMS Switch”. Granted by U.S. Patent Office, September 28, 2004, Patent #6,798,315 to Timothy M. Schaefer.

Patent Pending – “System and Method for Location-Based Security”. Submitted to U.S. Patent Office, September 2015.

Affiliations
LPICC – Low Probability of Intercept Communications Committee

Security Clearance
Active TS/SCI

Education
Master of Business Administration – Technology Management
University of Phoenix
Graduation Date: September 2006

Bachelor of Science – Electrical Engineering
University of WisconsinMilwaukee
Graduation Date: May 1993