Wesley Munger

Wesley Munger
wesx1001@gmail.com
Phone: (952) 687-9291
Minneapolis, MN 55369

Sr. Process & Development Engineer IV, ETCH Team Lead at Polar Semiconductor, LLC
Summary
Top 10% multi-industry ranked performer gifted at creative, trail-blazing, critical systems solutions with
extensive track-record of highly evolved and effective team leadership experience including technologist team
lead for beta-fab 200mm mixed process/substrate constant by wafer clean state insitu-ceramic dry-clean fior 8
poly/sti process technologies development innovations project management best practices excellence.
Experience
Sr. Process & Development Engineer, ETCH Team Lead at Polar Semiconductor, LLC
May 2013 – Present (2 years 9 months)
Develops, implements, optimizes and maintains multi-level-processes, best-known-processes/methods
industry solutions specialized in comprehensive scope PLASMA etch technologies spanning multiple critical
equipment platforms. Lead special teams in yield enhancement, defect reduction, etch cpk improvement,
scrap reduction, and critical poly and metals etch, clean/condition process development. Fab Lead developer
for FABVANTAGE BETA-FAB 200mm AMAT P5200 DPS Ceramic-chuck Constant-CLEAN-STATE bywfr-
insitu-ceramic-cleans (ICC) in complex mixed PROCESS/substrates and level POLY/STI manufacturing
non-harmonized processing regime and METAL DPS dry-cleans POLAR FAB trailblazer.
Sr. Process & Development ETCH Team Lead Engineer III/Technology Transfer FAB Team Lead at
TriQuint Semiconductor
July 2010 – June 2011 (1 year)
Etch module and Fab-to-Fab technology transfer/scale-up/FAB start-up team leader. Critical FAB projects
management Technologist expert lead. Develops, qualifies, controls, optimimizes, transfers, and implements
critical multi-process etch solutions for ramped fab technology start-ups and intra-fab transfers. Operations
and process development industry-leading expert at critical SC solutions. Multi-team and process champion
and excursions response expert with over 15 years high-tech industry manufacturing and R&D experience.
Member Group Technical Staff, Sr. Process, Integrations & Development ETCH Team Lead Engineer
III at Texas Instruments
May 1998 – January 2006 (7 years 9 months)
Owner of Etch/Diffusion/Wet clean processes for multiple, continuously-sustained product and development
devices across multiple fabs simultaneously. •Poly Etch/FEOL Guru •Flash Floating Gate Stack Etch
•Nitridation of Gate Oxide •CrSi Etch •GaAs Metals/BCB Vias/Mesa Etch •Multi Ash/
FSI Wet Cleans •Metals Etch •Advanced Process Control (APC) •Oxides Etch Creative
engineering solutions earned claims as the ‘go-to’ fab engineer regularly assigned by management, the
highest risk, fab-critical crisis state project/actions/technical leadership roles responsible for 24 elite
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engineering teams and delivering over 1000 presentations resulting in 100% rate of on-time deliverables for
Texas Instruments. Led fab-critical ‘Code-Red’ Excursion Response Team’ founded to rapidly contain,
diagnose, and engineer real-time solutions to complex emergency and/or chronic process, parametric, and
probe yield excursions securing critical business ventures and claimed extremely significant yield gains.
N.S.F. Fellowship R&D – CrSi Dry Etch Lead Developer at High Density Electronics Center (HIDEC)
June 1996 – January 1998 (1 year 8 months)
Ground-up research and development of lithography, metal-dep, strip, cleans and trailblazing dry-etch
process of anisotropic, highly selective CrSi stack substrate. Lead integrator of full-node process innovations
and successful final process solutions.
Volunteer Experience
Toys for Tot’s Holiday Volunteer at American Legion of the United States of America (1 yr) & multiyear
Church/Community Volunteering
December 2002 – Present (13 years 2 months)
Holiday period donations & delivery volunteer for Toy’s for Tots program as well as volunteering for weekly
food pantry assignment duty at Church of Christ in Dallas, TX. Continued volunteering work for the holiday
toys for tots programs and deliveries of donated foods during several years residencies in Texas, Arkansas,
and Florida through non-profit church and community affiliations.
Skills & Expertise
Process Simulation
Yield
Profit Maximization
Process Improvement
Root Cause Analysis
Strategic Creative Development
Solution Implementation
Cross-functional Team Leadership
Technological Innovation
Dry Etch
Characterization
Continuous Improvement
Manufacturing
Technology Transfer
Debugging
Product Development
Semiconductors
Design of Experiments
Engineering Management
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Semiconductor Industry
Electronics
Process Integration
SPC
Process Engineering
JMP
Six Sigma
Start-ups
Lean Manufacturing
Plasma Etch
Failure Analysis
CMOS
FMEA
Metrology
Silicon
ASIC
Analog
Thin Films
Testing
Materials Science
Engineering
Mixed Signal
RF
MEMS
Microelectronics
Nanotechnology
Electrical Engineering
Automation
Embedded Systems
Lithography
Sensors
Education
The University of Texas at Dallas
Master of Engineering (MEng), Electrical, 2001 – 2018
University of Arkansas
Bachelor’s of Science [B.S.Ch.E.], Chemical Engineering, 1998
Activities and Societies: First University fellowship grant award recipient for research in barrier properties
of high density poly-imides for potential applications in the microelectronics industry beginning in my
Sophomore year.. Awarded continued grants for 4 consecutive years based on research findings, poster thesis
presentations and published works including 1st and 2nd year as the SOLE university undergraduate to be
awarded SILO NSF Fellowship.
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Wesley Munger
Sr. Process & Development Engineer IV, ETCH Team Lead at Polar Semiconductor, LLC
Contact Wesley on LinkedIn